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FPC series laser cutting machine

The equipment is a special model for flexible circuit board, QR code and characters.

It is mainly used for cutting and forming covering film (CVL), flexible plate (FPC), soft and hard bonding plate (RF), and thin-layer plate. It can also be used for cutting various substrates, such as ceramics, silicon wafers, Teflon, etc.

Equipment characteristics

·Light spot is thin, cold light cutting, and thermal effect is small.

·Fully enclosed light path, graphics can be spliced, high precision.

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Description
Specification
Sample show

Equipment characteristics

01 Powerful laser performance

Non contact cutting, thin light spot, small thermal effect

02 High precision and efficiency

Equipped with linear motor, high speed, high-precision production

03 Professional cutting software

CCD vision, splicing and cutting, powerful manufacturing process.

04 Customizable high

Optional nanosecond, ultraviolet, CO2 and fiber lasers.

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Laser cutting machine